Er-Ping Li

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Electrical Modeling and Design for 3D System Integration. 3D Integrated Circuits and Packaging, Signal Integrity, Power Integrity and EMC

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Год написания книги 2018

New advanced modeling methods for simulating the electromagnetic properties of complex three-dimensional electronic systems Based on the author's extensive research, this book sets forth tested and...

Er-Ping Li

Произведения автора 1

РОМАНЫ и ПОВЕСТИ

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